• Ture one-step application
• No mixing or shaking needed
• Quick and easy to use
• Excellent bond strength
• Hema-free composition only a very thin layer required
• Reusable application dish
• Micro applicators included

Medicept Bond Plus Se (Self Etch Bonding Adhesive) is a state-of-the-art dental adhesive that offers simplified and efficient bonding in dental procedures. This single-component adhesive is designed based on proven ethanol/water solvent technology, providing total etch capability with reduced technique sensitivity. One of the key advantages of Medicept Bond Plus Se is its versatility, allowing for both wet and dry bonding applications. This makes it suitable for a wide range of direct and indirect dental procedures. The adhesive is filler loaded, which contributes to reduced micro-leakage and film thickness, while simultaneously increasing bond strength for reliable and long-lasting results.

With its user-friendly design, Bond Plus Se offers ultimate simplicity of use by combining etching, priming, and bonding into a single application. This saves valuable chairside time, allowing for more efficient treatment. The adhesive has been clinically proven to be reliable, ensuring consistent performance in various clinical situations.

Furthermore, Medicept Bond Plus Se demonstrates reduced post-operative sensitivity, providing a more comfortable experience for patients. Its ethanol/water solvent system optimally loads the adhesive with fillers (15%), further enhancing its properties.The Bond Plus Se adhesive is a seventh-generation bonding agent, eliminating the need for separate etchants or primers. By applying the adhesive directly, light curing, and proceeding with the composite restorative material, the process is streamlined and efficient. The material is also HEMA free, ensuring excellent biocompatibility.

Typical Strenght:

• Enamel: 26.4MPa (shear bond strength @ 24 hours)
• Dentine: 27.8Mpa (shear bond strength @ 24 hours)

• 1 x 5 ml bottle

• Prepare the tooth surface: Ensure that the tooth surface is clean and free from debris or contamination. If necessary, clean the tooth using a prophylaxis paste or dental cleaning solution, followed by rinsing and drying.
• Isolate the treatment area: Use appropriate dental dam or cotton rolls to isolate the treatment area to prevent contamination and maintain a dry environment.
• Apply Bond Plus Se adhesive: Shake the Bond Plus Se bottle well before use. Dispense a small amount of the adhesive onto a disposable applicator or brush. Apply the adhesive evenly to the tooth surface, covering the entire prepared area. Take care to avoid excess pooling or running of the adhesive.
• Agitate the adhesive: Using the applicator or brush, gently agitate the adhesive on the tooth surface for approximately 10 seconds. This helps to ensure proper distribution and penetration of the adhesive into the tooth structure.
• Light cure: After agitating the adhesive, immediately proceed to light cure 20sec using a dental curing light
• Proceed with restorative procedure: Once the adhesive has been light cured, you can proceed with the placement of the composite or compomer restorative material as per your treatment plan.
• Complete the restorative procedure: Continue with the restorative steps, such as contouring, shaping, and finishing the restoration, as needed. Follow standard dental procedures and techniques for achieving optimal results.

• Warranty is not applicable for this product.

Question:What are the advantages of using Medicept Bond Plus Se?

Answer: Medicept Bond Plus Se offers several benefits, including reduced micro-leakage, reduced film thickness, increased bond strength, time-saving application, and reliable performance. It has been clinically proven for consistent results.

Question:How does Medicept Bond Plus Se work?

Answer: Medicept Bond Plus Se utilizes ethanol/water solvent technology to etch, prime, and bond the tooth surface. It creates a reliable bond to enamel, dentin, and metal, making it suitable for use with both composite and compomer restorative materials.